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The audio IC processes all sound input and output — microphone signals, speaker audio, and headphone audio. A failed audio IC causes complete audio loss across all outputs, or selective failure of specific audio paths such as the loudspeaker working but the headphone jack producing no sound.
What You Will Need
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Replacement audio IC (model-specific, exact part number)
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Hot air rework station
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Microscope
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BGA reballing kit and stencil (if BGA packaged)
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Flux, solder paste, and solder wick
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Tweezers
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Isopropyl alcohol and PCB brush
Step 1 — Isolate the Audio Fault
Test all audio outputs systematically: loudspeaker, earpiece, headphone jack, and Bluetooth audio. A failure pattern restricted to hardware audio outputs — with Bluetooth audio working normally — typically points to the audio IC rather than a mechanical component failure.
Step 2 — Access the Motherboard
Remove the phone completely to access the main board. The audio IC is typically identifiable in schematic diagrams or via teardown guides specific to your phone model.
Step 3 — Remove the Faulty IC
Apply flux to the chip perimeter. Heat evenly with a hot air station until solder reflows, then remove with tweezers. Clean the pad site thoroughly with solder wick and IPA. Inspect pads under magnification for any lifted traces.
Step 4 — Install the Replacement
Reball or apply solder paste to the new IC. Position it precisely on the pad array with flux, reflow with controlled hot air, and allow to cool before moving the board.
Step 5 — Test All Audio Paths
Reassemble and systematically test every audio pathway — loudspeaker volume at multiple levels, earpiece during a call, headphone jack with wired earphones, and microphone recording. All paths passing confirms a successful audio IC replacement.
