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The Power Management IC is the central power distribution hub of the smartphone, routing power from the battery to every subsystem: CPU, display, cameras, radios, and sensors. PMIC failure causes symptoms ranging from no power-on to partial hardware failures affecting specific phone functions.
What You Will Need
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Replacement PMIC (exact part number for your phone model)
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Hot air rework station (temperature-controlled)
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Microscope
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BGA reballing kit and stencil
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Flux and solder paste
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Solder wick
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Isopropyl alcohol and PCB brush
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Anti-static mat and wrist strap
Step 1 — Diagnose PMIC Failure
PMIC failure is typically identified after ruling out simpler faults. Symptoms include: phone powers on only on charge, intermittent boot loops, certain hardware subsystems (camera, Wi-Fi) dead despite intact connections, or excessive heat near the PMIC region on the board.
Step 2 — Remove the Motherboard
Disassemble the phone completely to access the motherboard. Identify the PMIC location on the board — typically a large BGA IC near the centre or battery connection region.
Step 3 — Remove the Old PMIC
Apply flux around the chip, heat with hot air at 340–370°C using a wide-tip nozzle to ensure even reflow across all BGA balls simultaneously. Lift the chip cleanly once reflow is complete. Clean pads with solder wick and IPA.
Step 4 — Reball the Replacement PMIC
Apply the appropriate BGA stencil, load with solder paste, and reflow the balls onto the new chip before placing it on the board. Alternatively, use pre-reballed chips from a trusted supplier.
Step 5 — Reflow and Inspect
Place the reballed PMIC on the cleaned board pads with flux applied. Reflow with controlled hot air and inspect under a microscope for any bridging. Test the phone before final reassembly.
