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BGA Repair Service in Nairobi
BGA — Ball Grid Array — repair is the most advanced and most demanding category of smartphone board-level repair. BGA chips are the largest and most complex integrated circuits on a smartphone motherboard, connecting to the board through an array of solder balls that can number in the hundreds or thousands, all hidden beneath the chip body. Repairing a BGA fault requires specialist equipment, deep technical knowledge, and precise process control that most repair shops cannot offer.
BGA repair encompasses several distinct procedures depending on the nature of the fault. Reflow — applying controlled heat to the installed BGA chip to re-melt and resettle failed solder joints — is the least invasive intervention and is appropriate for joint failures caused by thermal fatigue. Reballing — removing the chip, stripping old solder, applying new balls, and reinstalling — addresses more severe joint failures. Full BGA replacement — removing the failed chip and installing a new one — is carried out when the chip itself has suffered internal failure.
Each of these procedures requires a hot air rework station or infrared reflow station with precise temperature profiling. The thermal profile — how quickly the board is preheated, how long the reflow temperature is maintained, and how quickly it is cooled — must be matched to the specific board construction and chip package to avoid damaging the board or adjacent components through thermal stress.
Prologic Technologies on Luthuli Avenue carries out BGA repair for smartphone motherboards, including processor and RAM package reflow, modem chip replacement, and power management IC reballing. Each job begins with a diagnostic phase that confirms the BGA fault before any heat work is applied to the board.
Luthuli Avenue, Nairobi CBD 0723 763 173
