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Reballing Service in Nairobi
Reballing is the process of removing the solder balls from the underside of a Ball Grid Array (BGA) chip, cleaning the chip and the board pads, and reapplying a fresh set of solder balls before reinstalling the chip on the motherboard. It is a technique used when BGA chip solder joints have failed — either through thermal fatigue, mechanical stress from a drop, or the natural aging of the solder interconnects — without the chip itself having suffered internal failure.
BGA chips are used for the most critical functions on a smartphone motherboard: the processor, RAM, storage, modem, and power management IC are all commonly BGA packages. Their solder interconnects — hundreds of tiny balls of solder that form both the electrical connections and the mechanical bond between the chip and the board — are invisible once installed and are entirely enclosed beneath the chip body. When they fail, the symptoms can be severe: total device failure, intermittent power loss, RAM errors, or storage corruption.
Reballing is appropriate when the chip itself is confirmed functional but the solder ball interconnects have failed. It is a more conservative — and more affordable — intervention than full chip replacement, and when carried out correctly, it restores the chip to full function with a fresh set of high-quality solder balls.
Prologic Technologies on Luthuli Avenue performs reballing using the correct BGA stencils for each chip's ball pattern, lead-free solder balls of the appropriate diameter, and a controlled reflow process that ensures consistent ball height and complete wetting across all pads. Post-reflow inspection under magnification confirms ball quality before the chip is reinstalled.
Luthuli Avenue, Nairobi CBD 0723 763 173
